激光切割机

MDI Advanced Processing GmbH LC 800

MDI
Type: Laser cutting system LC 800
MDI laser cutting system
Laser cutting system LC 800 with UC-2000 laser controller and
MSA control system 9010 LCD for gas warning system
Technical data:
Machine data:
Ibodpjd N Erqofx Af Dof
Machine dimensions: (L x W x H) 2,520 mm x 2,090 mm x max. 1,945 mm
Control cabinet dimensions: (W x D x H) 600 mm x 600 mm x 2,000 mm
Machine weight: Approx. 2,500 kg
Control cabinet weight: Approx. 1,000 kg
Control: Siemens S7-300 and Siemens Simotion
Spindle drives: THK
Rotation axis: Harmonic Drive
Table size: 810 mm x 680 mm
Max. substrate size: 650 mm x 780 mm
Number of Cutting heads: 2 (laser for glass cutting, knife for foil cutting)
Number of cutting tables: 1
Workpiece clamping: Lasercut frame for laser cutting, vacuum plate for foil cutting
Noise level:

廣告是自動翻譯的，翻譯中可能會出現一些錯誤。