电线键合机

Kulicke and Soffa 8030

The K&S 8030 was a wire bonder, likely a specialized or less common variant.

Based on the architecture of the 8000-series bonders, the typical specifications were approximately:

Parameter Typical 8000-Series Capability
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Bonding method Thermosonic wire bonding
Wire types Gold (Au), Aluminum (Al) depending on configuration
Bond type Ball bonding or wedge bonding (model-dependent)
Positioning Vision-assisted X-Y motion control
Bonding area Typically 50–100 mm class work envelope
Applications IC packaging, hybrids, chip-on-board, microelectronics
Automation Programmable automatic bonding sequences

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