SMD回流焊炉

Essemtec RO 300

Basic configuration

Oven type: Reflow soldering oven with full convection heating

Heating zones: 3 zones (convection)

Cooling zone: 1 zone (active air cooling)

PCB handling: Mesh belt or optional pin (chain) conveyor

PCB transport direction: Left → right


Dimensions (L × W × H): approx. 2000 × 710 × 1200 mm

Weight: approx. 237 kg


Controller: Microprocessor (LCD, languages incl. English/German/French)

Program capacity: 49 profiles (fixed + freely programmable)

Temperature setting: °C / °F

Temperature range: approx. 20°C – 300°C per zone


Max. reflow width: 10 – 300 mm

Conveyor speed: 100 – 800 mm/min (with optional slow-speed module)

Transport repeatability: ± 2 mm/min


Full convection air circulation:

Total heating air: 1200 m³/h

Per zone: 400 m³/h

Cooling zone: 300 m³/h

Atmosphere: air (standard), optional N₂ model available


Power requirement (EU): 3×400 VAC, 50 Hz, ~25 A

Power requirement (US): 3×208 VAC, 60 Hz

Continuous power: ± 6.1 kW

Start-up/warm-up power: ± 10 kW during initial warm-up

Min. exhaust: approx. 2×250 m³/h recommended

📊 Other details

Exhaust: 2 ports (80 mm), temperature < 55°C

Sound level: max. 70 dB(A)

Safety certifications: CE, EN954-1 Class 3

Features: emergency stop, overheat protection


✔ Reflow soldering of SMT printed circuit boards (Pb-free and standard)
✔ Continuous production and small to medium batch sizes
✔ Prototyping and R&D applications
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✔ Optional air or nitrogen operation (depending on model)

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