2010年Cleveland G-APU 5

Cleveland G-APU 5

Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package).

Accessories:

Total enclosure,

Camera system, image field 20 x 16 mm

Extraction system 4000/3 D 240 3kW 630 m³/h

Swivel unit for package dressing

Software for converting DXF files to CNC files on PC

Touchscreen

Standard software for straight, bevel or radii etc. DXF files.
Single Diamond- / CBN grinding wheel diameter: 400 mm
Single-disc width: 30 mm
Packages: packages to Ø 150 mm and width 150 mm
Swivel axis: swivel plate for swivel angle: +/- 95 degrees
Delivery axis travel: 82 mm
Oscillation hub : 83 mm
Spindle mounting diameter: 60 mm
DIA/CBN wheel flange hole: 32 mm
Speed of silicon wafer: 700 - 2800 rpm
SIC Grinding Spindle: 60 mm Ø
Workpiece clamping X-axis travel: 185 mm
Y-axis travel: 194 mm
Workpiece spindle head holder diameter : 100 mm
with belt spindle diameter : 100 x 200 mm
Grinding wheel balance: max. 40 kg
Workpiece spindle speed: 500 - 1500 rpm
SIC discs up to max.: 200 x 20 mm x 32 mm
Connected load: approx. 2.5 kW (400 Volts / 50 Hz)
Dimensions W x D x H: 2000 x 2000 x 2600 mm
weight: 1200 kg
colour: red RAL 3003 / grey RAL 7035
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