用于电路板的对流回流焊接系统

Rehm REFLOE SMS-N2-V4 - 3000

Application: Convection reflow soldering system for printed circuit boards, soldering system for printed circuit boards (e.g. SMD and/or mixed construction type) and drying of SMD adhesives
Functions: Infeed, preflow, soldering, cooling, outfeed

Functionality/condition: functional until dismantling

No minimum price - guaranteed sale at the highest bid!

TECHNICAL DETAILS
Temperature: 200 - 210 °C
Throughput speed: 1,000 mm/min
Workpiece length: max. 200 mm

Energy requirement
Total power requirement: 50 kW
Electrical operating power: 12 kW

Connection
Shielding gas with nitrogen: 30 m³/h; 6 - 10 bar overpressure
Water requirement: 20 l/min; 2 - 5 bar overpressure
Extraction air volume: 1,000 m³/h

Dimensions and weight
Space requirement: 6,500 mm + 2,000 (loading station) x 1,400 x 2,100 mm
Machine weight: approx. 2.0 t

EQUIPMENT
- Software functions, can be integrated into a production line
- Additional equipment incl. automatic stacking device LSB 03 with reloading head and outfeed conveyor for holding PCBs, for example
- Machine is CE98 certified